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Team Group T-FORCE G50 512 GB M.2 PCI Express 4.0 NVMe 3D NAND
SKU
TM8FFE512G0C129
£91.75
£76.46
In stock
Approx. 36 available.
512GB, M.2 2280, PCIe Gen4x4, NVMe, 325 TBW. 3.3V, Black
- A new choice for gaming upgrade
- Preset controller solutions
- Different caching grading systems offered to cover users’ needs
- Ultra-thin patented graphene heat-sink makes installations painless
- Optimized performance operation that balances reliability and lifetime
- Smart product status monitoring system
- An environmental protector
- Patented graphene heatsink
- US invention patent (certificate no.: US11051392B2)
- Taiwan invention patent (certificate no.: I703921)
- China utility patent (certificate no.: CN 211019739 U)
- S.M.A.R.T. software patent
- Taiwan invention patent (No.: I751753)
| SKU | TM8FFE512G0C129 |
|---|---|
| EAN | 4711430801728 |
| Manufacturer | Team Group |
| Availability | Y |
| Product Family | T-FORCE |
A new choice for gaming upgrade
T-FORCE G50 Pro / G50 PCIe4.0 SSD adopt PCIe Gen4x4 interface. Having read and write speeds reaching 5000 MB/s, the SSDs allow users to enjoy gaming on a new level with easy upgrades and storage capacity increase.
Preset controller solutions
T-FORCE G50 Pro / G50 PCIe4.0 SSD use InnoGrit controller solutions by default, allowing users a peace of mind in their usage experience.
Different caching grading systems offered to cover users' needs
The SSDs come with different grading systems to suit different needs: T-FORCE G50 Pro PCIe4.0 SSD supports DRAM Caching and SLC Caching, whereas T-FORCE G50 PCIe4.0 SSD only supports SLC Caching. Choose the one that suits you best.
Ultra-thin patented graphene heat-sink makes installations painless
The patented ultra-thin heat-sink is made from the optimal heat conductive material—graphene, offering painless, interference-free installations on gaming PCs, gaming, laptops, and PS5 consoles.
Optimized performance operation that balances reliability and lifetime
Windows TRIM SSD Optimization makes sure Free Block is made into use upon being released to speed up transmission and write performances. The wear-leveling technology and ECC enhance data transmission reliability while prolonging SSD lifetime.
Smart product status monitoring system
TEAMGROUP’s patented S.M.A.R.T. monitoring software tracks SSD status at all times and conducts fast and simple settings and inspections to monitor the SSD’s quality status and performance.
An environmental protector
The entire production is lead-free and halogen-free, RoHS-compliant, and adopts recyclable environmentally friendly materials for packaging to conserve Earth by being eco-friendly.
T-FORCE G50 Pro / G50 PCIe4.0 SSD adopt PCIe Gen4x4 interface. Having read and write speeds reaching 5000 MB/s, the SSDs allow users to enjoy gaming on a new level with easy upgrades and storage capacity increase.
Preset controller solutions
T-FORCE G50 Pro / G50 PCIe4.0 SSD use InnoGrit controller solutions by default, allowing users a peace of mind in their usage experience.
Different caching grading systems offered to cover users' needs
The SSDs come with different grading systems to suit different needs: T-FORCE G50 Pro PCIe4.0 SSD supports DRAM Caching and SLC Caching, whereas T-FORCE G50 PCIe4.0 SSD only supports SLC Caching. Choose the one that suits you best.
Ultra-thin patented graphene heat-sink makes installations painless
The patented ultra-thin heat-sink is made from the optimal heat conductive material—graphene, offering painless, interference-free installations on gaming PCs, gaming, laptops, and PS5 consoles.
Optimized performance operation that balances reliability and lifetime
Windows TRIM SSD Optimization makes sure Free Block is made into use upon being released to speed up transmission and write performances. The wear-leveling technology and ECC enhance data transmission reliability while prolonging SSD lifetime.
Smart product status monitoring system
TEAMGROUP’s patented S.M.A.R.T. monitoring software tracks SSD status at all times and conducts fast and simple settings and inspections to monitor the SSD’s quality status and performance.
An environmental protector
The entire production is lead-free and halogen-free, RoHS-compliant, and adopts recyclable environmentally friendly materials for packaging to conserve Earth by being eco-friendly.
| Hard drive | |
|---|---|
| PCI Express interface data lanes | x4 |
| SSD capacity | 512 GB |
| Memory type | 3D NAND |
| Performance | |
| Windows operating systems supported | Windows Vista, Windows 7, Windows 8, Windows 8.1, Windows 10, Windows 11 |
| Mac operating systems supported | Yes |
| Linux operating systems supported | Kernel 2.6.33, Yes |
| Interface | PCI Express 4.0 |
| Component for | Universal |
| NVMe | Yes |
| Low-density parity-check (LDPC) | Yes |
| TBW rating | 325 |
| PCI Express interface data lanes | x4 |
| SSD capacity | 512 GB |
| S.M.A.R.T. support | Yes |
| TRIM support | Yes |
| Memory type | 3D NAND |
| Mean time between failures (MTBF) | 300000 h |
| Endurance | |
| Mean time between failures (MTBF) | 300000 h |
| Features | |
| Interface | PCI Express 4.0 |
| Component for | Universal |
| NVMe | Yes |
| Low-density parity-check (LDPC) | Yes |
| TBW rating | 325 |
| PCI Express interface data lanes | x4 |
| SSD capacity | 512 GB |
| Windows operating systems supported | Windows Vista, Windows 7, Windows 8, Windows 8.1, Windows 10, Windows 11 |
| S.M.A.R.T. support | Yes |
| TRIM support | Yes |
| Mac operating systems supported | Yes |
| Linux operating systems supported | Kernel 2.6.33, Yes |
| Memory type | 3D NAND |
| Mean time between failures (MTBF) | 300000 h |
| SSD form factor | M.2 |
| M.2 SSD size | 2280 (22 x 80 mm) |
| Power | |
| Operating voltage | 3.3 V |
| Design | |
| Component for | Universal |
| Cooling type | Heatsink |
| Product colour | Black |
| SSD form factor | M.2 |
| Weight & dimensions | |
| Width | 22 mm |
| Weight | 7 g |
| Height | 3.7 mm |
| Depth | 80 mm |
| System requirements | |
|---|---|
| Windows operating systems supported | Windows Vista, Windows 7, Windows 8, Windows 8.1, Windows 10, Windows 11 |
| Mac operating systems supported | Yes |
| Linux operating systems supported | Kernel 2.6.33, Yes |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Non-operating shock | 1500 G |
| Operating vibration | 20 G |
| Technical details | |
| Interface | PCI Express 4.0 |
| S.M.A.R.T. support | Yes |
| Operating temperature (T-T) | 0 - 70 °C |
| TRIM support | Yes |
| Storage temperature (T-T) | -40 - 85 °C |
| Non-operating shock | 1500 G |
| Operating vibration | 20 G |
| Product colour | Black |
| SSD form factor | M.2 |
| Warranty period | 5 year(s) |
| Compliance certificates | Federal Communications Commission (FCC), CE, UKCA, EAC, RoHS |
| Doesn't contain | Lead, Mercury, Cadmium |
| Sequential read/write | Yes |
| Sequential writing speed | 2500 MB/s |
| Sequential reading | 5000 MB/s |
| Certificates | |
| Waste Electrical and Electronic Equipment (WEEE) compliance | Yes |
| Software | |
| Windows operating systems supported | Windows Vista, Windows 7, Windows 8, Windows 8.1, Windows 10, Windows 11 |
| Mac operating systems supported | Yes |
| Linux operating systems supported | Kernel 2.6.33, Yes |
| Certification | |
| Waste Electrical and Electronic Equipment (WEEE) compliance | Yes |
| Other features | |
| Cooling type | Heatsink |
| Product colour | Black |
| Sequential read/write | Yes |
| Sequential writing speed | 2500 MB/s |
| Sequential reading | 5000 MB/s |
| Warranty period | 5 year(s) |
| Compliance certificates | Federal Communications Commission (FCC), CE, UKCA, EAC, RoHS |
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|---|---|---|---|---|---|---|
| SKU |
TM8FFE512G0C129
|
4XB1D04756
|
AC037408
|
4XB1L68661
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OTLC5123DNVMEM.2/80
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SNV3S/500G
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| Manufacturer |
Team Group
|
Lenovo
|
DELL
|
Lenovo
|
Origin Storage
|
Kingston Technology
|
| Component for |
Universal
|
Notebook
|
PC/notebook
|
PC/notebook
|
PC/notebook
|
PC/notebook
|
| SSD capacity |
500GB to 800GB
|
500GB to 800GB
|
500GB to 800GB
|
500GB to 800GB
|
500GB to 800GB
|
400GB to 500GB
|
| SSD form factor |
M.2
|
M.2
|
M.2
|
M.2
|
M.2
|
M.2
|
| Interface |
PCI Express 4.0
|
PCI Express 4.0
|
PCI Express 4.0
|
PCI Express 4.0
|
PCI Express 3.0
|
PCI Express 4.0
|
| Memory type |
3D NAND
|
N/A
|
N/A
|
N/A
|
3D TLC
|
3D NAND
|





