Team Group XTREEM FFXD532G8000HC38DDC01 memory module 16 GB 2 x 16 GB DDR5 8000 MHz

SKU
FFXD532G8000HC38DDC01
£175.14 £145.95
In stock
Only 4 left
DDR5, 32GB, 2 x 16, 8000Mhz
  • Honorable T-FORCE Logo exceeds overclocking limits
  • Meticulously layered high-quality aluminum sandblasted fin for exceptional heat dissipation
  • Sturdy 2mm heat spreader for perfect heat dissipation improvement
  • High-quality IC with the patented technique
  • Power management chip for stable and effective power usage
  • On-Die ECC for a more stable system
More Information
Internal memory type DDR5
Memory clock speed 8000 MHz
Internal memory 16 GB
Memory layout (modules x size) 2 x 16 GB
SKU FFXD532G8000HC38DDC01
EAN 4711430800882
Manufacturer Team Group
Availability Y
Product Family XTREEM
Honorable T-FORCE Logo exceeds overclocking limits
With T-FORCE LAB’s superb R&D capability, the brand-new T-FORCE XTREEM DDR5 exceeds the frequency limit of DDR5 memory. The product has T-FORCE logo symbolizing our utmost pride, showcasing its exceptional existence, it is definitely the best choice in the world of overclocking products.

Meticulously layered high-quality aluminum sandblasted fins for exceptional heat dissipation
Inspired by the image of energy conversion between the hot and cold under high temperatures from a volcano, the exterior and looks of T-FORCE XTREEM DDR5 has meticulously layered high-quality aluminum sandblasted fins resembling the texture of basalt and the beach, delivering exceptional heat dissipation capabilities. The surface is etched with T-FORCE logo to certify its excellence.

Sturdy 2mm heat sink for perfect heat dissipation improvement
T-FORCE XTREEM DDR5 adopts 2mm aluminum alloy heat spreader to increase its quality and heat capacity. The product also has thermal gap pad with high thermal conductivity to strengthen PMIC heat dissipation effects, coupled with anti-acid, alkaline, rust and inconducive anodic treatment on the surface to deliver perfect heat dissipation performance overall.

High-quality IC with patented technique
Uses our proprietary IC grading testing validation technique—GRADING METHOD FOR MEMORY (Invention patent number in Taiwan: I751093; Invention patent number in USA: US11488679B1) to develop DDR5 high-performance memory module successfully.

Power management chip for stable and effective power usage
Power management chip minimizes noise interference, stabilizes power and distributes power to each electronic component effectively, supplying power to the system with stability and fastness.

On-Die ECC for a more stable system
Supported with On-die ECC providing error correction and detection, the mechanism stabilizes the system while pursing performance.

Lifetime warranty
Comprehensive lifetime warranty is offered where exchanges free-of-charge for non-man-made damage are available under a simple and streamlined service.
Memory
Memory layout (modules x size)2 x 16 GB
Internal memory16 GB
Memory clock speed8000 MHz
Internal memory typeDDR5
Features
Memory layout (modules x size)2 x 16 GB
Internal memory16 GB
Memory clock speed8000 MHz
Internal memory typeDDR5

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SKU
FFXD532G8000HC38DDC01
4ZC7A08708
R0X06A
F4-3600C18D-32GTZN
M378A4G43AB2-CWE
AB120719
Manufacturer
Team Group
Lenovo
HPE
G.Skill
Samsung
DELL
Component for
N/A
PC/server
PC/server
PC/server
PC
PC/server
Internal memory
16GB
16GB
64GB
32GB
32GB
32GB
Memory form factor
N/A
RDIMM
N/A
N/A
288-pin DIMM
288-pin DIMM
Internal memory type
DDR5
DDR4
DDR4
DDR4
DDR4
DDR4
Memory layout (modules x size)
2 x 16 GB
2 x 8 GB
1 x 64 GB
2 x 16 GB
1 x 32 GB
1 x 32 GB
ECC
N/A
N/A
N/A
N
N
N/A
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